We are seeking a mid-career R&D Microwave and Sensor Engineer to design, fabricate, test, qualify, and deliver custom-designed microwave components. These components enable military communication systems, SAR imaging, and Doppler radar, tagging tracking, and locating hardware. Our team is seeking a driven RF engineer capable of fundamental electromagnetic modeling, transistor-level circuit simulation, and distributed element microwave PCB design. It is also important to understand electronic die characterization, RF test equipment, working knowledge of solder assembly, PCB development, and fabrication.

On any given day, you may be called on to:

• Use circuit modeling tools to design analog or RF integrated circuit components for transceivers including analog, mixed-signal, and RF components.
• Review/Write specifications for radar component design
• Specify fabrication steps to build custom-designed printed circuit boards to test integrated circuit components
• Troubleshoot analog or RF circuits in an innovative electronics lab
• Characterize custom-designed RF components and modules over voltage, temperature, and environmental stresses.
• Contribute to developing new ideas and proposals for research activities for the department.
• Use electronic equipment to measure slew rate, gain, stability, phase noise, jitter, s-parameters, power output, P1dB, PSat, noise figure, modu

Qualifications we Require:

• Master's in Electrical Engineering or;
• Bachelor's in Electrical Engineering plus four (4) years experience
• Radio Frequency design experience
• Electrical test and measure practices to protect sensitive devices and equipment to troubleshoot high-frequency circuitry
• Use RF test equipment such as spectrum analyzers, vector network analyzers, pulsed signal generators, oscilloscopes, and precision power supplies.
• Ability to acquire and maintain a DOE Q clearance

Qualifications We Desire:

• Knowledge of designing distributed-element active microwave circuits such as detectors, receivers, and power amplifiers.
• Strong written and presentation skills to provide sponsors and vendors with convincing evidence of quality designs
• Ability to work independently and within a multi-disciplinary team of peers to meet specifications
• Strong interpersonal skills which include teamwork, effective leadership, negotiation, delegation, and conflict resolution
• Understanding of:
  • fabrication process for printed circuit boards
  • die attaching, wire bonding, and packaging
  • advanced automated assembly processes for die and very small SMT components
  • Strong electrical test and measure skills at the module and die level
  • Experience:
    
    • developing complex microsystem solutions including analog, digital, RF, and other technologies
    • modeling electromagnetic effects on and off-die
• Active DOE Q or DOD TS clearance

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